PLASMA ETEC

a dry-etching process that uses ionized reactive gas plasma to precisely remove material from silicon wafers and create nanoscale patterns with high anisotropy and selectivity.

Linco Technology Co., Ltd.

Plasma Etcher / FOPLP, Advanced Substrate

UVAT Technology Co. ,Ltd

Sputter & Dry Etch

If you have any questions, feel free to ask me! ¡Si tiene alguna pregunta, no dude en preguntarme! Wenn Sie irgendwelche Fragen haben, können Sie mich gerne fragen!