SEMICONDUCTOR PACKAGING

Encloses bare silicon dies in protective casings using wire bonding, flip-chip, 2.5D/3D IC, Fan-Out, and SiP to enable electrical connections, thermal dissipation, and environmental shielding for chips.

C SUN MFG. LTD.

Horizontal Sliding Automatic Door Nitrogen Clean Oven

GALLANT MICRO. MACHINING CO., LTD

Die Sorter / Die Bonder

Manz Taiwan Ltd.

FOPLP RDL plating process equipment

If you have any questions, feel free to ask me! ¡Si tiene alguna pregunta, no dude en preguntarme! Wenn Sie irgendwelche Fragen haben, können Sie mich gerne fragen!