Laser Film Removal System for Reclaimed Wafers

.An efficient and eco-friendly alternative to traditional wet chemical processes for film removal, eliminating the need for chemical soaking and reducing pollution and wastewater treatment.

.Capable of removing various thin films such as Si₃N₄, SiO₂, and poly-Si, enhancing process flexibility.

.Dual-laser sources with precise energy control enable high efficiency and zero substrate damage.

.Shortens process time, increases throughput, and enhances wafer reuse.

.Supports automated handling to ensure stable transport and reduce the risk of cross-contamination.

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