Sputter:

In line sputter system Advanced packaging process:

UBM(Under Bump Metallurgy)

RDL(Redistribution Layer)

Sputter Ti/Cu seed layer

Characteristic: Low temperature sputtering process

Low output time/high capacity design

Good sidewall coverage

Good film adhesion

Vehicle automatic return system

Dry Etch:

Horizontal Plasma Etch Equipment

Plasma Dry Etch

Plasma Thin down

Plasma Desmear

Plasma Descum

Plasma Pre-treatment

Characteristic:

High-speed dry etching process

High etching uniformity

Modular design to achieve low cost/low footprint

Advanced packaging(Panel Fan-Out FOPLP/FOWLP)

High-end carrier board application technology

With semiconductor-grade EFEM configuration