Linco Technology specializes in the production of printed circuit board (PCB) plasma/sputter equipment. As the sole designated supplier of SiP EMI sputtering equipment for a leading American smartphone manufacturer, we currently hold a market share of over 70%. In addition, we have been recognized as a distinguished supplier by USI in 2015, an outstanding strategic partner by ASE in 2020, and the recipient of the 2022 Central Taiwan Science Park Innovation Product Award.

In-line Sputter Equipment Information:

Application: Conformal shielding or passivation/Desmear/Metallization.

Substrate: SiP module/IC substrate/PCB/Wafer/FOPLP, etc.

Carrier: Dimension: 610x700 mm2

Degas module: Substrate temperature up to 200℃

Plasma treatment module: Surface activation & cleaning/Demear / Descum/Plasma etching

Sputtering module: Planar magnetron

Thickness uniformity:<+-5%

Uniformity of R&R:<+-3%