Traditional electron microscopy materials analysis heavily relies on sample preparation (cutting/coating conductive layers) to enable sample observation with an electron beam in a vacuum environment. However, this series of procedures can result in permanent object damage and the loss of opportunities for further process testing. Additionally, it is challenging to establish a comprehensive understanding of the object due to the difficulty of sampling at multiple points and in large quantities.

TEMIC’s the latest flagship model of electron microscope, the MIS MARS X8 Plus, utilizes "non-destructive e-beam inspection technology for large objects" to provide automated positioning and analysis for 15-inch large objects. It enables high-resolution electron microscopy imaging and defect composition analysis for chucks, photomasks, packaged IC, printed circuit board assemblies (PCBAs), and wafers on FFC (film frame carrier). Even non-conductive materials like quartz/ceramic with poor conductivity can be analyzed without the need for cutting or coating. The system is equipped with a wafer-level precision positioning stage, allowing the importation of coordinate lists from automated optical inspection systems (AOI) for automated defect positioning and SEM/EDS review. This enables accurate and efficient identification of process defects and abnormal particles.