GPM AMHS Total Solution
Gallant Precision Machining Co. Ltd.
.Meeting the defect inspection requirements before and after wafer dicing in advanced packaging processes.
.Post-dicing inner crack inspection machine.
.Sub-nanometer precision Auto Scan White Light Interferometer applications.
.Nondestructive high penetration depth 3D imaging.
.Guided user interface with real-time simulation and inspection functionality.
.AI-based automatic defect detection and classification.
.Fully automatic panel-level grinding.
.Fully automatic Strip grinding (magazine in/ magazine out).
.Fully automatic polisher.
