About Manz Asia

Manz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.

From laboratory and pilot production to small-series and mass production, Manz provides comprehensive equipment solutions for wet chemistry, plating, digital printing, automation, and proprietary software integration, meeting the Redistribution Layer (RDL) process requirements. These technologies are widely applied in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, addressing every stage of semiconductor packaging manufacturing.

By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.

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Manz CoPoS – Comprehensive Panel-Based Solutions for Diverse Semiconductor Packaging Architectures

Manz’s CoPoS (Chip-on-Panel-on-Substrate) represents a broad framework of panel-based manufacturing techniques utilized within the semiconductor industry. It encompasses technologies such as IC substrate production — whether organic or glass-based — and subsequent package assembly. It further incorporates Fan-Out (FO) Panel Level Packaging (PLP), employing Redistribution Layer (RDL) technologies on large panel carriers to enhance processing efficiency and scalability.

CoPoS: Powering Larger Packages for High-End Applications

The rise of AI and high-performance computing is reshaping landscape of semiconductor packaging. As chip sizes grow — with larger dies, and heterogeneous integration becoming the norm — the demand for scalable, panel-level solutions is more critical than ever. In response, Manz’s CoPoS (Chip-on-Panel-on-Substrate) technology delivers solutions for producing larger form factors across a wide range of chip packaging frameworks and materials, enhancing scalability, flexibility, and production efficiency.