FOPLP RDL plating process equipment
Manz Taiwan Ltd.
•Trusted high-uniformity plating for panels from 310 mm to 700 mm, proven in mass production by leading manufacturers
•Jig-free design for easy operation and reduced maintenance
•Modular architecture for flexible capacity expansion
•Multi-anode system for high uniformity and reduced edge effect
•Automatic contact inspection before plating
•High ASD capability for thick copper plating
•Inline chemical control with auto dosing (CMS)
•Advanced agitation system for uniform ion distribution
•Flexible anode configuration for complex geometries
•Real-time process monitoring
