FOPLP RDL plating process equipment
- Trusted high-uniformity plating for panels from 310 mm to 700 mm, proven in mass production by leading manufacturers
- Jig-free design for easy operation and reduced maintenance
- Modular architecture for flexible capacity expansion
- Multi-anode system for high uniformity and reduced edge effect
- Automatic contact inspection before plating
- High ASD capability for thick copper plating
- Inline chemical control with auto dosing (CMS)
- Advanced agitation system for uniform ion distribution
- Flexible anode configuration for complex geometries
- Real-time process monitoring
