Laser Film Removal System for Reclaimed Wafers

• An efficient and eco-friendly alternative to traditional wet chemical processes for film removal, eliminating the need for chemical soaking and reducing pollution and wastewater treatment.
• Capable of removing various thin films such as Si₃N₄, SiO₂, and poly-Si, enhancing process flexibility.
• Dual-laser sources with precise energy control enable high efficiency and zero substrate damage.
• Shortens process time, increases throughput, and enhances wafer reuse.
• Supports automated handling to ensure stable transport and reduce the risk of cross-contamination.